TITLE

Effect of grain structure on the onset of diffusion-controlled stress relaxation in Pt thin films

AUTHOR(S)
Hyun, S.; Vinci, R.P.; Fahey, K.P.; Clemens, B.M.
PUB. DATE
October 2003
SOURCE
Applied Physics Letters;10/6/2003, Vol. 83 Issue 14, p2769
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
The thermomechanical behavior of Pt thin films was studied using the substrate curvature technique. Films of identical thickness but different grain size were prepared by sputtering directly onto a thermally grown SiO[sub 2] layer on a (100) Si wafer. Predictions from a thin-film version of the deformation mechanism map model and the diffusional wedge are compared to the experimental results. The diffusional wedge model most accurately predicts the onset of diffusion-controlled stress relaxation in columnar Pt films. The use of an effective film thickness equal to the grain size improves the match to noncolumnar microstructures. © 2003 American Institute of Physics.
ACCESSION #
10964904

 

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