Understanding Selective Pallet Soldering Residue

Munson, Terry
September 2003
Circuits Assembly;Sep2003, Vol. 14 Issue 9, p46
Trade Publication
Discusses the processing of electronic sensing products through the use of selective wave soldering pallets. Capability of selective pallet soldering to control the effect of processing residue; Efficiency of the process; Considerations in the use of the process.


Related Articles

  • Reflow Profile Optimization. Scheiner, David // SMT: Surface Mount Technology;Sep2003, Vol. 17 Issue 9, p60 

    Features the use of generic reflow profile with solder plate as the key tool for process optimization and defect minimization in surface mount assemblies. Impact of the modification of the generic profile to the optimization of solderability and minimization of the given assembly; Discussion of...

  • Selective Soldering --- Options and Opportunities. Schlessmann, Heike // SMT: Surface Mount Technology;Feb2004, Vol. 18 Issue 2, p60 

    Focuses on the selective soldering techniques used in electronic manufacturing processes in the electronics industry in the U.S. Evidence of reflow soldering technology; Cause of the demand for new and more appropriate production processes; Factors to be considered in reflow soldering technology.

  • Laser Diode Soldering. Goldberg, Gary // SMT: Surface Mount Technology;Feb2005, Vol. 19 Issue 2, p20 

    Provides an expert opinion in preference for laser diode soldering over wave soldering as the primary method in electronics manufacturing. Selective soldering of various products with low- to mid-volume component/connector counts; Consistency and reliability in the manufacturing process;...

  • AXI Conquers Hidden Joint Defects. Jessen, Jeremy // SMT: Surface Mount Technology;Feb2005, Vol. 19 Issue 2, p38 

    Focuses on the use of lamniographic automated X-ray inspection for solder-joint inspection. Detection of several categories of defects in electronic manufacturing; Image-processing techniques used by the lamniographic AXI system to identify an area array solder-joint defect; Verification of the...

  • Industry, Academia Look to Lead-free. Della, Christine A. // SMT: Surface Mount Technology;Aug2003, Vol. 17 Issue 8, p4 

    Reports that the electronic industry and academics are sharing their knowledge about the switch over to lead-free in Marlboro, Massachusetts. Manufacture of lead-free soldering technology products; Characterization of the physical behavior of the equipment; Implementation of the lead-free...

  • Riding the Mini Wave. Gaither, Reed // Assembly;Aug2009, Vol. 52 Issue 8, p34 

    The article discusses the advantages of automated selective soldering with a miniature wave in comparison with conventional wave soldering equipment in the field of electronics assembly. With this type of technology, less energy, more control, and less dross are attained. Consulting engineer...

  • Hewlett-Packard shares lead free soldering technology. Martinez, Marialba // Caribbean Business;11/21/2002, Vol. 30 Issue 47, p16 

    Reports on the discovery of a lead-free, low temperature soldering process for use in the electronics industry in Puerto Rico. Government's investment in the Hewlett-Packard research and development technology center; Center's main objective of researching and developing products and...

  • Lead-free Reliability. Jennie S.Hwang // SMT: Surface Mount Technology;Dec2004, Vol. 18 Issue 12, p14 

    Discusses the importance of the reliability of a lead-free assembly in the process of converting to a lead-free electronics manufacturing system in the U.S. Variation in the requirements for the solder-joint reliability with the type of products; Test schemes established to understand the creep...

  • SMT step by step. Belmonte, Joe // SMT: Surface Mount Technology;Feb2005, Vol. 19 Issue 2, p84 

    Discusses the influence of lead-free material characteristics on process engineers implementing and optimizing the lead-free assembly process. Understanding of the components of the electronics product prior to the introduction of lead-free soldering material; Investigation of component...


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics