TITLE

M[sup3]D Technology Makes Bond Pad Redistribution a Snap

AUTHOR(S)
King, Bruce; Renn, Michael
PUB. DATE
September 2003
SOURCE
Circuits Assembly;Sep2003, Vol. 14 Issue 9, p40
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Provides information on the requirements for integrated circuit design. Redistribution of microchip for chip-scale packages; Utilization of the bond pad redistribution option for peripheral die interconnects; Capabilities of the M³D system which aided the integrated circuit design process.
ACCESSION #
10763673

 

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