Don't Overlook the Details

Hymes, Les
August 2003
Circuits Assembly;Aug2003, Vol. 14 Issue 8, p31
Trade Publication
This article discusses about what should be done to stop micro-etch disintegration and deal with global standards in circuits assembly industry. These standards for newer devices, such as ball grid arrays, are generally the same throughout the industry, providing for land pattern commonality. Problems occur with devices using land patterns that deviate from the IPC-SM-782 Land Pattern Standard. Modifying land patterns to accommodate specific assembly location requirements makes achieving a uniform approach to worldwide design and assembly practices difficult and leaves assemblies incompatible with worldwide capabilities.


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