20/20 Foresight: Detecting Bridges Before They Occur

Prince, David P.; Pham-Van-Diep, Gerald C.
August 2003
Circuits Assembly;Aug2003, Vol. 14 Issue 8, p26
Trade Publication
The solder paste print operation is widely recognized as a primary source of defects in surface-mount assembly. One approach to increasing yields is to detect print defects immediately after the print operation and reject defective boards before the placement of electronic components. This practice enables surface mount manufacturers to save time otherwise wasted in the assembly of defective boards and avoids costly rework.


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