20/20 Foresight: Detecting Bridges Before They Occur

Prince, David P.; Pham-Van-Diep, Gerald C.
August 2003
Circuits Assembly;Aug2003, Vol. 14 Issue 8, p26
Trade Publication
The solder paste print operation is widely recognized as a primary source of defects in surface-mount assembly. One approach to increasing yields is to detect print defects immediately after the print operation and reject defective boards before the placement of electronic components. This practice enables surface mount manufacturers to save time otherwise wasted in the assembly of defective boards and avoids costly rework.


Related Articles

  • 01005: SIZE DOES MATTER. NISSAN, ARBEL // Printed Circuit Design & Fab: Circuits Assembly;Feb23015, Vol. 32 Issue 2, p26 

    The article explains several challenges in designing printed circuit boards (PCBs) with the 01005 component. Topics covered include the difficulty of manually repairing tiny areas of the 01005 component, requirements for special soldering techniques and correct solder paste application for...

  • Solder Paste vs. Flux-only Attachment for BGA Rework. Wettermann, Bob // SMT: Surface Mount Technology;Jan2005, Vol. 19 Issue 1, p38 

    This article focuses on area array rework process in BGA (Ball grid array) networks. There are numerous practical solder paste application methods for reworking area array devices. The most common method used to selectively apply solder paste in reworking is using a metal or one-time use plastic...

  • Lead-free Solder to Bring Back Vapor Phase Soldering? Kenyon, William G. // SMT: Surface Mount Technology;Oct2003, Vol. 17 Issue 10, p16 

    Discusses the consideration of the impact of vapor phase soldering on lead-free solder adoption. Replacement of heated air in convection ovens during the days of eutectic tin/lead solder over vapor phase; Introduction of a series of vapor phase soldering fluids in the study; Legislation issued...

  • PRODUCT SPOTLIGHT.  // Circuits Assembly;Jul2005, Vol. 16 Issue 7, p46 

    This section presents information on several electronic products available as of July 2005. S3088AV from Viscom AG offers full reflow inspection of assemblies up to 400 x 350 mm. The multicore TTC-LF from Henkel permits soldering irons to be re-tinned, even when sponges, pads or rosin-cored...

  • Clean It Up! Munson, Terry // Circuits Assembly;Nov2005, Vol. 16 Issue 11, p60 

    The article explains that incoming board and component cleanliness is importance in making reliable products in the electronics industry. Dirty bare boards and components are some common culprits when ionic cleanliness is in question. Plating processes and tap water rinse cycles are known to...

  • Improving Solder-Paste Processes Through Experimentation. Craig, Bill // SMT: Surface Mount Technology;Dec2004, Vol. 18 Issue 12, p38 

    Examines a screening design of experimentation using an evolutionary operation approach to understand the proper application of solder paste onto a printed circuit board and ultimately improve electrical yields. Importance of the process in surface mount assembly; Need to optimize and control...

  • Lead-free: Controlling Tombstoning Behavior. Benlih Huang; Ning-Cheng Lee // SMT: Surface Mount Technology;Jul2005, Vol. 19 Issue 7, p44 

    This article studies tombstoning behavior on a series of lead-free solders and attempts to find a way to control the problem. The move toward lead-free soldering augments the concern about tombstoning, presumably due to the speculated high-surface tension of lead-free solders. Tombstoning has...

  • Solder Paste Printing Inspection. Litman, Efrat // SMT: Surface Mount Technology;Jan2004, Vol. 18 Issue 1, p30 

    Looks at the factors that users of 3-D AOI machines for control of solder paste printing should take into consideration. Importance of small changes in the height of the deposit; Challenges to be met for ensuring accurate inspection; Alternative to extrapolating the volume of a deposit;...

  • STEP 3: Solder Materials. Hwang, Jennie S. // SMT: Surface Mount Technology;Mar2004, Vol. 18 Issue 3, p52 

    Provides information on solder materials. Parallel approaches to soldering; Absence of systemic changes in components and printed circuit board materials; Correlation of the mechanical properties with the specific percentage of silver or copper content; Soldering temperature of the modification...


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics