Next-Generation Laser Rework

Farrell, Robert; Wang, Paul P.E.
August 2003
Circuits Assembly;Aug2003, Vol. 14 Issue 8, p22
Trade Publication
This article compares the latest generation laser rework platform with a common forced convection platform. Many ball grid arrays (BGAs) and microBGAs are reworked using forced convection rework platforms capable of replacing BGAs with a reliability that meets or exceeds that of the original assembly. Specifically, BGAs may only be rated to a maximum temperature of 245�C or 250�C, whereas joints must be reflowed to 235�C to 245�C. Achieving the desired joint temperatures without exceeding the maximum allowable BGA package temperature is difficult using the current forced convection rework platforms.


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