TITLE

Rework with Lead-Free Solders

AUTHOR(S)
Wood, Paul
PUB. DATE
August 2003
SOURCE
Circuits Assembly;Aug2003, Vol. 14 Issue 8, p18
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Temperature differences between eutectic and lead-free solders mandate tighter processes, better profiles and precise rework systems. Time, cost, quality, repeatability: these are the primary concerns of the repair and rework cycle. Today, small, sensitive array packages, with complex profiles and hundreds of connections that can only be seen with sophisticated vision systems, fill the manufacturing landscape. Operator turnover is great; yet, operator experience with array packages is essential if time and quality goals are to be achieved. INSET: Lead-Free Rework Process Development at NEMI.
ACCESSION #
10469050

 

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