Rework with Lead-Free Solders

Wood, Paul
August 2003
Circuits Assembly;Aug2003, Vol. 14 Issue 8, p18
Trade Publication
Temperature differences between eutectic and lead-free solders mandate tighter processes, better profiles and precise rework systems. Time, cost, quality, repeatability: these are the primary concerns of the repair and rework cycle. Today, small, sensitive array packages, with complex profiles and hundreds of connections that can only be seen with sophisticated vision systems, fill the manufacturing landscape. Operator turnover is great; yet, operator experience with array packages is essential if time and quality goals are to be achieved. INSET: Lead-Free Rework Process Development at NEMI.


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