August 2003
Circuits Assembly;Aug2003, Vol. 14 Issue 8, p11
Trade Publication
Herndon, Virginia-based National Electronics Manufacturing Initiative, Great Britain-based Soldertec of Tin Technology Ltd. and the Japan Electronics and Information Technology Industries Association held a tin whisker joint meeting in May 2003 in Tokyo, Japan to update the status of the current programs and exchange data crucial to the selection of key test parameters. At the meeting, they reached an agreement to form a joint project team to study tin whisker growth mechanisms. The team will propose a draft Tin Whisker Test Method to the International Electrotechnical Commission by 2004.


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