TITLE

Legacy Electronics Gets 3-D Memory Module Patent

PUB. DATE
August 2003
SOURCE
Circuits Assembly;Aug2003, Vol. 14 Issue 8, p8
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
San Clemente, California-based Legacy Electronics Inc., a manufacturer, designer and tester of high-speed, high-density memory modules, printed circuit boards and other computer products, has announced that it was granted U.S. Patent Number 6,545,868 B1 by the U.S. Patent and Trademark Office as of April 8, 2003. The patent covers new three-dimensional multi-chip memory modules incorporating Legacy's earlier patented Canopy printed circuit board subassembly and process technology.
ACCESSION #
10468938

 

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