Ion-induced chemical vapor deposition of copper films with nanocellular microstructures

Ross, F.; Thompson, C.V.; Chiang, T.; Sawin, H.H.
August 2003
Applied Physics Letters;8/11/2003, Vol. 83 Issue 6, p1225
Academic Journal
Ion-induced chemical vapor deposition using a broad ion beam has been used to deposit nanocellular films. These films consist of closely packed 10–20 nm diameter copper rods separated by a carbonaceous residue, and growing in a direction normal to the substrate surface to lengths equal to the film thickness. The effects of ion flux, ion energy, and substrate temperature on rod spacing were investigated. A growth mechanism analogous to that leading to cellular structures during solidification from alloy melts is proposed and qualitatively described. Films with nanocellular structures are expected to have useful, highly anisotropic properties. © 2003 American Institute of Physics.


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