TITLE

Thermal paste with a cool solution for PCs

AUTHOR(S)
Pierce, Julia
PUB. DATE
July 2003
SOURCE
Engineer (00137758);7/25/2003, Vol. 292 Issue 7632, p15
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
Reports on the development by U.S. materials researchers Deborah Chung of a thermal paste that could help solve the problem of overheating in high-performance personal computers and other electronic devices. Carbon-filled organic material; Dispersal of carbon in mixture of polyethylene glycol and dissolved ethyl cellulose; Paste's thermal conductive ability.
ACCESSION #
10463754

 

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