TITLE

CSP ASIPs can solve many packaging dilemmas

AUTHOR(S)
Seto, Wayne
PUB. DATE
July 2003
SOURCE
Portable Design;Jul2003, Vol. 9 Issue 7, p16
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
Focuses on the development of application-specific integrated passive arrays or integrated passive devices in chip-scale packages (CSP). Benefits of CSP; Process involved in the CSP fabrication; Performance between a discrete passive solution and a CSP device; Thermal coefficient of expansion.
ACCESSION #
10295121

 

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