TITLE

Self-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuits

AUTHOR(S)
Ramanath, G.; Cui, G.; Ganesan, P. G.; Guo, X.; Ellis, A. V.; Stukowski, M.; Vijayamohanan, K.; Doppelt, P.; Lane, M.
PUB. DATE
July 2003
SOURCE
Applied Physics Letters;7/14/2003, Vol. 83 Issue 2, p383
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Preserving the structural and functional integrity of interfaces and inhibiting deleterious chemical interactions are critical for realizing devices with sub-50 nm thin films and nanoscale units. Here, we demonstrate that ∼0.7-nm-thick self-assembled monolayers (SAMs) comprising mercapto-propyl-tri-methoxy-silane (MPTMS) molecules enhance adhesion and inhibit Cu diffusion at Cu/SiO[SUB2] structures used in device metallization. Cu/SAM/SiO[SUB2]/Si(001) structures show three times higher interface debond energy compared to Cu/SiO[SUB2] interfaces due to a strong) chemical interaction between Cu and S termini of the MPTMS SAMs. This interaction immobilizes Cu at the Cu/SAM interface and results in a factor-of-4 increase in Cu-diffusion-induced failure times compared with that for structures without SAMs.
ACCESSION #
10220397

 

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