Selecting the Optimal Test Strategy

Oresjo, Stig
July 2003
Circuits Assembly;Jul2003, Vol. 14 Issue 7, p14
Trade Publication
Today's printed circuit board (PCB) assembly test engineers face significantly more test challenges than just a few years ago. Board complexity is dramatically increasing with more components, more joints, higher densities and new package technologies. Fortunately, test and inspection methods such as solder paste inspection, automatic x-ray inspection and automatic optical inspection have emerged over the past several years. Several factors influence what test technologies are the right selection for a particular PCB assembly.


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