Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing

Cheng, Hsi-Kuei; Lin, Yu-Jie; Chang, Hou-Chien; Liu, Kuo-Chio; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih-Ming
May 2015
Metallurgical & Materials Transactions. Part A;May2015, Vol. 46 Issue 5, p1834
Academic Journal
The morphological evolution of Cu pillars capped with Sn-1.8 wt pct Ag solder during high-temperature annealing was investigated. Two intermetallic compounds (CuSn + CuSn) formed at the Cu/solder interface which changed the pillar's morphology. Surface diffusion enhanced the growth of CuSn + CuSn around the pillar brim and transformed the pillar top from a plane into a truncated cone. Bulk diffusion dominated after long-term annealing and the pillar top became hemispherical shaped. A mechanism was proposed to explain the unusual morphological evolution.


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