Soitec Progenitor Moves to Protect Smart Cut Patent

June 2003
Electronic News;6/16/2003, Vol. 49 Issue 24, pN.PAG
Trade Publication
Reports on the effort of the French research organization CEA-LETI to reissue a U.S. patent covering the Smart Cut process of silicon-on-insulator wafer supplier Soitec SA as of June 2003. Information on the patent; Claims included in the patent.


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