TITLE

Soitec Progenitor Moves to Protect Smart Cut Patent

PUB. DATE
June 2003
SOURCE
Electronic News;6/16/2003, Vol. 49 Issue 24, pN.PAG
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Reports on the effort of the French research organization CEA-LETI to reissue a U.S. patent covering the Smart Cut process of silicon-on-insulator wafer supplier Soitec SA as of June 2003. Information on the patent; Claims included in the patent.
ACCESSION #
10058212

 

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